Call for papers

Reach us Call for Papers

The 1st International Conference on Power Electronics-ECCE Asia (IEEE ECCE Asia 2025) is scheduled to take place from May 11th to 14th, 2025, in Bengaluru, India. This event is organized by the IEEE Power Electronics Society (PELS). Since its inception, ECCE Asia has evolved into a highly respected conference that significantly contributes to the progress of power electronics technologies.

ECCE Asia 2025 will offer diverse programs, including notable presentations, Industry exhibitions, networking opportunities, and tours, fostering productive discussions and facilitating interdisciplinary collaborations to advance your research endeavors. We warmly invite all interested parties to participate in ECCE Asia 2025 in Bengaluru, India.

CALL FOR PAPERS (PDF)    
Call for papers Call for papers

Call for papers

Topics of Interest

The topics will cover research and activities across all fields related to power electronics including, but not limited to, the following topics. Energy Conversion Systems and Applications

  •    Renewable and alternative energy power Electronics systems
  •    Critical power and energy storage systems
  •    Aerospace energy conversion systems
  •    Grid-forming technologies
  •    High power/voltage power conversion (HVDC, FACTS and multi-terminal DC systems)
  •    Power-to-X and green hydrogen systems
  •    Microgrids, hybrid ac/dc grids, and de grids
  •    Energy Access and off-grid systems
  •    Energy conversion for information technology and communication systems
  •    Electrification for commercial, industrial and transportation applications
  •    Big data and artificial intelligence in energy conversion
  •    Wireless power transfer
  •    Lighting applications and displays
  •    Industrial motor drives
  •    Medical, loT and energy harvesting
  •    Power electronics for agriculture

Component, Converter and Subsystem Technologies

  •    Power electronic devices, gate drivers, and integrated circuits
  •    Passive components and materials
  •    Power electronic packaging integration
  •    Reliability, advanced fault protection systems, diagnostics, prognostics, and health management
  •    Thermal management and advanced cooling technologies
  •    Innovative magnetic materials, alternative conductor and winding insulation technologies
  •    Electromagnetic interference and electromagnetic compatibility
  •    Power conversion topologies, modulation, and control
  •    Electrical drive systems and topologies and their control
  •    Rotating/linear electromechanical devices
  •    Advanced manufacturing
  •    Digital twins, cloud design and simulation techniques for energy conversion systems
  •    Cyber-and-physical security for power electronics systems